Acquire Automation XT

An own development from the beginning

Acquire Automation XT - the key to Industry 4.0

Acquire Automation XT carries out the measurement of components, the evaluation of measurement data and the logging of results in a fully automated way. Easy recipe creation, multi-sensor measurement or hybrid metrology, compliance with industry standards, complex measurement tasks, all this is standard in Acquire Automation XT. With the integration of different robot systems and the interfaces for remote control, full integration into production is an easy step.

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Highlights AAXT

  • Full automation of 2D and 3D measurements
  • Selection of numerous measuring tasks, filters and evaluations according to SEMI and DIN-EN-ISO standards
  • Easy composition of individual measuring recipes with individual sample geometries and layouts
  • Management of measurement results in database and export to various formats or direct transfer to a tracing system
  • Integration of actuators such as robotic systems for sample handling and heating tables into the measuring sequence
  • Seamless integration into production environments with interfaces for remote control such as SEMI SECS/GEM, iTAC
  • Intuitive user interface with level-based user rights according to SEMI specifications
[Translate to English:] Software report update


With the recipe-based software Acquire Automation XT, the fully automatic execution and evaluation of measurements is possible. Select the measurement and evaluation routine suitable for your measuring task from a variety of packages. Different parameters can be set depending on the respective evaluation method. Furthermore, formatting functions (filters) are also available. For recurring structures, a layout wizard with graphical user interface (GUI) can support you in learning the measurement positions. In addition, a sample fine alignment by means of pattern recognition is optionally available. A detailed overview of all available packages, evaluation parameters and filters can be found here.

In the following you will learn more about our focus topics Multi-Sensor Setup, Hybrid Metrology and Defect Inspection.

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Multi-Sensor Setup

The components and measurement tasks are becoming increasingly complex, so that certain measurement tasks often cannot be solved by one sensor alone because the desired parameters are not directly accessible. Due to the multi-sensor concept we pursue, the 3D surface measuring instruments of the proven MicroProf® series can be equipped with point and area sensors for topography measurement, as well as with coating thickness sensors and even an atomic force microscope. This offers the possibility to solve a measuring task with different sensors by performing a measurement with each sensor and combining the different results. The decisive step is that the measuring device or the recipe used knows the complete measuring task and implements it completely. This means that not only the measurements with all necessary sensors are done automatically, but the software also records the different measurement results and calculates the desired parameters.

Hybrid Metrology

Our Acquire Automation XT software makes it possible to combine the results of different measurements or evaluations in a downstream hybrid analysis, whereby the previously measured individual values are used to calculate new result parameters. This approach is known as "hybrid measurement technology". This is clearly a strength of our multi-sensor instruments. The hybrid analysis tool is designed to be very flexible. Besides basic calculation functions such as subtraction or multiplication, complex arithmetic operations are also possible. The hybrid analysis is easily set up in a separate dialog where all input values and the output value(s) are defined with the specific calculation formula(s). Once set up, the hybrid analysis can be used in a fully automated measurement process.

Here is an example:

The present layer system is located on a wafer (opaque silicon substrate), above it is a transparent oxide layer and in a limited area additionally an opaque copper layer. If the step height of the copper layer is measured with an optical topography sensor, the common step height of the non-transparent copper layer and the transparent oxide layer is actually measured. In order to determine the thickness of the copper layer, the thickness of the copper layer including the transparent oxide layer is first measured with a topography sensor. Furthermore, the thickness of the transparent oxide layer is measured separately with a layer thickness sensor. By subtracting the oxide thickness from the previously determined total thickness, the desired step height of the copper layer is obtained.

Defect Inspection

FRT's automated defect inspection enables a maximum high quality level during the entire manufacturing process. The intelligent defect analysis is based on advanced software that enables semiconductor manufacturers to avoid loss of revenue by detecting defects at an early stage. It monitors the data of the inspection results, detects and classifies defects such as spot defects and scratches within seconds based on user-defined criteria. It meets the defect analysis requirements of semiconductor fabs and offers the user a number of functions for checking and displaying inspection data. Furthermore, the data can be managed and analyzed. The software also allows the user to define specific regions of interest (ROIs) and classify defects located within these regions.

The software allows the user to optimize the recipe for collecting data for each inspection step, thus ensuring advanced process control. The recipe monitors the source memory for the software and reads every file with the inspection results that is written to the folder. It then analyzes the error distribution of the results file according to user-defined criteria and outputs a KLARF file in which the error signatures are classified. The analyzed KLARF file can then be loaded into the inspection results database.

Our defect inspection software provides effective visualization, versatile processing and fast generation of wafer maps as well as precise quantification and comprehensible documentation of defects. The software enables the user to display different views of a selected data set, e.g. wafer map and defect list with number, position, size and grey value of the respective defects. The defects are assigned according to the user-defined attributes and synchronized with the defect list.

Recipes, results, export

Not only the user interface, but also the presentation of the measurement results and the evaluation can be adapted at any time and individually tailored to your needs. Different measuring positions on individual components, but also several similar samples in a holder can be automatically examined in one measuring run. For this purpose, different sample geometries can be taught-in and brought into the correct measuring position via pattern recognition and automatic fine alignment.


Measurement recipes can be created intuitively and modularly with the SEMI-compliant and easy-to-understand graphical user interface. Individual measurements from an automated measurement sequence can be called up again at a later date and thus viewed in detail or repeated. Depending on the use of the instrument, there are different operator levels with different access rights. If necessary, parameters can be adjusted in the recipe sequence and critical measuring points can be specifically checked with little time expenditure. To further facilitate the creation of recipes in Acquire Automation XT, individual tasks can be executed during recipe processing. Where the scans of a measurement are defined, the selected task can be measured and the results viewed. Previous tasks, such as alignments or reference measurements, can also be included in the process. It is also possible to customize the evaluations and view intermediate results. The effects of the evaluation adjustments can thus be viewed directly.

The evaluation of the measurement data is carried out, for example, by taking into account the current SEMI or also DIN EN ISO standards. Furthermore, it is possible to define pass/fail criteria for the measurement and apply them automatically. In combination with a handling system, sorting can be carried out, thus increasing the yield. The sample classification function in Acquire Automation XT thus offers an intelligent method for classifying measured samples based on the measurement and analysis results generated. The result values can be sorted into user-defined classes and the sample can be assigned to an overall classification based on the distribution of the individual results to the different classes.

The results and reports, including information on sample classification, can be viewed in the Data Log section.

The raw data of each measurement can be exported in a variety of different file formats. These include the performance-optimized .frt file format and various text-based ASCII formats.

Measurement results are stored in a database and can be exported during the measurement process or at any time later as a result list or measurement report.

Handling, Robots, SECS/GEM

For many industrial applications it is necessary to perform measurements fully automatically with high throughput rates. For this purpose an automatic handling of the samples is necessary. The MicroProf® is specifically designed for the semiconductor, MEMS and LED industries and can be easily configured for different sample types and wafer types.


The handling unit is equipped with a robot arm with vacuum end effector, loading stations for open or closed cassettes including mapper and optional OCR reader, pre-aligner etc. It is able to process wafer sizes from 2 to 12 inches. Depending on the configuration, up to 4 cassettes can be processed simultaneously.

Every functionality of the handling system is accessible via the comfortable user interface of FRT Acquire Automation XT and fully integrated into the process flows.

For integration into existing MES systems, an important aspect in Industry 4.0, modules for different interfaces are available. In the semiconductor area we support the SECS/GEM standard for all wafer sizes below 300mm as well as the GEM300 standard from 300mm wafer diameter. Thus we cover the handling of all common wafer sizes. Additional modules are available for other industries, e.g. for integration into iTAC.

Read our articles about the AAXT series.

AAXT series

FRT offers the right measurement technology including software for your application. We are happy to help you solve your measurement tasks by creating the best system configuration for you.


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