Many industrial applications require fully-automated measurements with high throughput. This, in turn, requires automatic handling of the samples. The MicroProf® MHU has been specially designed for the semi-conductor, MEMS and LED industry and can be easily configured for various sample (wafer) types. The handling unit can handle wafer sizes between 2 and 12 inches. Depending on the configuration, up to four cassettes can be processed simultaneously.
Both, the tabletop tool and the standalone systems of the MicroProf® series include the option for two-sided sample inspection. This enables for measurement of the top and bottom side of the sample simultaneously and determination of the sample thickness. The total thickness variation (TTV) of the sample can be determined along with surface parameters, e.g. the roughness, waviness and flatness of both surfaces. The TTV option can be easily retrofitted on site.
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