MicroProf® FS

Highlights MicroProf^® FS

multi-sensor technology and hybrid metrology for MEMS and Foundries
customisable for a wide range of applications within the Wafer Foundry
standardised and customer-specific solutions
greatest possible flexibility
handling of diverse substrate types
powerful software for fully-automated 2D and 3D surface metrology
equipment Front End Module (EFEM)

The standard fully automated wafer metrology tools – FE, FS, AP and DI

The standard fully automated wafer metrology tools – FE, FS, AP and DI - combine the capabilities of the worldwide established MicroProf® 300, with a wafer handling system within an Equipment Front End Module (EFEM). With fully SEMI-compliant metrology solutions and almost maintenance-free hardware components, the MicroProf® with EFEM is configurable for any front end high-volume fab (FE), for a wide range of applications in the silicon wafer foundry (FS), applications at different 3D packaging process steps (AP) or comprehensive inspection applications (DI).

The MicroProf^® FS is a fully-automated wafer metrology tool. It can be configured for a wide range of applications within the Wafer Foundry or the MEMS Fab and uses both standardised and customer-specific solutions. Its enormous versatility makes the MicroProf^® FS a real "all-rounder" in the cutting-edge Foundry. That is why we call it the Foundry Star!

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TTV Option

Both, the tabletop tool and the standalone systems of the MicroProf^® series include the option for two-sided sample inspection. This enables for measurement of the top and bottom side of the sample simultaneously and determination of the sample thickness. The total thickness variation (TTV) of the sample can be determined along with surface parameters, e.g. the roughness, waviness and flatness of both surfaces. The TTV option can be easily retrofitted on site.