Highlights MicroProf® FE

  • fully automated 2D and 3D surface metrology for Front-End applications
  • multi-sensor technology, based on the MicroProf® 300
  • specific inline solution
  • wafer Handling Module
  • equipment Front End Module (EFEM)

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MICROPROF® FE

The MicroProf® FE is the standardised, fully-automated 2D / 3D wafer metrology tool. Due to its entirely SEMI conformal metrology solutions as well as nearly maintenance-free hardware components, which allow a high throughput, the MicroProf® FE is the perfect "workhorse" for every Front-End fab. The standard configuration can be enhanced by many optional functions, even as on site upgrade at a later date. Keep pace with the rapid technological development at reduced investment costs - with the MicroProf® FE!

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TTV Option

Both, the tabletop tool and the standalone systems of the MicroProf® series include the option for two-sided sample inspection. This enables for measurement of the top and bottom side of the sample simultaneously and determination of the sample thickness. The total thickness variation (TTV) of the sample can be determined along with surface parameters, e.g. the roughness, waviness and flatness of both surfaces. The TTV option can be easily retrofitted on site.