MICROPROF® FE

Highlights MicroProf^® FE

fully automated 2D and 3D surface metrology for Front-End applications
multi-sensor technology, based on the MicroProf^® 300
specific inline solution
wafer Handling Module
equipment Front End Module (EFEM)

The standard fully automated wafer metrology tools – FE, FS, AP and DI

The standard fully automated wafer metrology tools – FE, FS, AP and DI - combine the capabilities of the worldwide established MicroProf® 300, with a wafer handling system within an Equipment Front End Module (EFEM). With fully SEMI-compliant metrology solutions and almost maintenance-free hardware components, the MicroProf® with EFEM is configurable for any front end high-volume fab (FE), for a wide range of applications in the silicon wafer foundry (FS), applications at different 3D packaging process steps (AP) or comprehensive inspection applications (DI).

The MicroProf^® FE is the standardised, fully-automated 2D / 3D wafer metrology tool. Due to its entirely SEMI conformal metrology solutions as well as nearly maintenance-free hardware components, which allow a high throughput, the MicroProf^® FE is the perfect "workhorse" for every Front-End fab. The standard configuration can be enhanced by many optional functions, even as on site upgrade at a later date. Keep pace with the rapid technological development at reduced investment costs - with the MicroProf^® FE!

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TTV Option

Both, the tabletop tool and the standalone systems of the MicroProf^® series include the option for two-sided sample inspection. This enables for measurement of the top and bottom side of the sample simultaneously and determination of the sample thickness. The total thickness variation (TTV) of the sample can be determined along with surface parameters, e.g. the roughness, waviness and flatness of both surfaces. The TTV option can be easily retrofitted on site.