Highlights MicroProf® AP

  • flexible multi-sensor metrology tool for advanced packaging
  • for every process step from TSV etching, RDL/UBM/bumping to Cu nail reveal, dicing, stacking and molding
  • wafer handling unit with SEMI-standard FOUPs/FOSBs and open cassettes
  • individual configuration for your specific applications
  • retrofit on demand

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The MicroProf® AP is a fully automated wafer metrology tool, for a wide range of applications at different 3D packaging process steps, e.g. for the measurement of photoresist (PR) coatings and structuring, through silicon vias (TSVs) or trenches after etching, μ-bumps and Cu pillars, as well as for the measurement in thinning, bonding and stacking processes. With its high flexibility and universality, enabled by its modular multi-sensor concept, it is ideally suited to perform a wide range of measurement tasks in advanced packaging within one metrology tool.

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The MicroProf® AP is designed for fully automated processing of 300 mm FOUPS/FOSBs and 300 mm/200 mm/150 mm open cassettes. Moreover, the tool can be also configured for processing frame cassettes and handling of panels. The handling part features a robot with end-effector, two load ports including mapper and RFID reader, pre-aligner and optional OCR reader stations. The system is able to handle SEMI standard wafers, highly warped wafers (e.g. eLWB), bonded wafers, wafers on tape, TAIKO, bare and thinned wafers and even fan-out wafers. The EFEM is equipped with filter fan units (FFU) providing ISO class 3 clean room conditions within the tool.

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POWERFUL RECIPES FOR EVERY PROCESS STEP

The tool is run by the SEMI-compliant Acquire Automation XT software. In addition, fine sample alignment via pattern recognition is available. This software provides comprehensive capabilities, from manual measurement on the device to fully automated measurement with one-button-operation and integration into production control systems, e.g. via a SECS/GEM interface.

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