Excerpt: It used to be that people thought about metrology for front-end process control and inspection for advanced packaging. As wafer level packaging (WLP) and heterogeneous integration (HI) approaches became more advanced, metrology processes began creeping into back-end process control, where measurement becomes trickier and more diversified. As part of the 3D InCites Award Winners series, I spoke with Thomas Fries, CEO of FRT, winner of Equipment Supplier of the year. We talked about how technology diversification is here to stay, and how hybrid metrology solutions using multi-sensor technology are becoming necessary.
Full interview here: Read now