This year’s 6th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges, but also talks on 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, thermal management and 3D alternative technologies in order to create Heterogeneous Integration and High Density Systems for different applications.
Reputable keynote and invited speakers will present their choices and strategies among the 3D Integration technologies pallet, giving particular attention to current adoption for applications such as high-end memories, performance applications, mobile, imaging and automotive.
SEMI intends to highlight the latest business challenges and opportunities in the 3D sector by kicking off the summit with a market briefing. At the market briefing, attendees will hear from several 3D and packaging industry experts who will present their exclusive business & market insights and reverse engineering analysis confirming the huge growth of advanced packaging as forecasted.
You will find us at booth #9.
Location: art’otel Dresden, Ostra-Allee 33, Dresden 01067
More info, click here.