SEMI-compliant thickness and TTV measurement

Full wafer thickness map in 3D view, polished Si wafer

4 profiles of a polished Si wafer showing thickness variation

Measurement of global and local wafer parameters

Full wafer thickness map in 3D view

Wafer map with local parameters (LTIR, LTV, LT, LFPD, etc.)

Thin film and layer stack measurement

Film thickness, SiO2 layer on a Si wafer

Film thickness analysis of a 500 nm SiO2 layer on a Si wafer using a fit algorithm

Combination of different sensors, automated calculation of the desired sample parameters

Example of hybrid metrology

Bump dimensions and coplanarity

Area measurement of a bump array

Profile measurement of a bump array

DIN/ISO-compliant roughness and waviness measurement

Area measurement of a polished Si wafer, sRa = 0.766 nm

Profile measurement of a Si wafer, Ra = 13.8 nm

Bond layer thickness using IR technology

Four thickness profiles (star pattern) across a bonded wafer

Detection of voids in the bond interface

Imaging of hidden structures using IR microscope

DISCO HI-TEC EUROPE GmbH, Stealth laser grooves in a bare Si wafer

Alignment mark on a cavity-SOI wafer

Overlay measurement

Automatic recognition of marks and determination of overlay shift

Overlay map: example of display of overlay errors

High aspect ratio vias and TSV

Area measurement of a single TSV

Profile measurement of a single TSV (depth, top & bottom CD)

High aspect ratio trenches

Area measurement of a wafer with trenches

Profile measurement of a single trench

Defect inspection

3D topography of a Si wafer with voids

3D topography of a dimple on a Si wafer

Standard topography measurement

Area measurement of a SiO2 membrane

Profile measurement of a SiO2 membrane

SEMI-compliant bow and warp measurement

Full wafer map of a Si wafer in 3D view showing bow

Profile of the top topography of a Si wafer

Wafer thickness and layer thickness using IR technology

Thickness of a Si wafer, post grinding

Thickness of a Si membrane

RST measurement using IR technology

Thickness of a bonded Si wafer, device wafer before grinding

Thickness of a bonded Si wafer, device wafer after grinding/etching

Wafer stress measurement

Wafer bow before thin film deposition

Wafer bow after thin film deposition

Nanotopography on polished and ground wafers

Full area measurement of a 300 mm Si wafer

Result map after filtering shows nanotopography features

Automated detection and reporting of saw marks

Area measurement of saw marks on a Si wafer

Topography of a Si wafer along the blue line

SEMI-compliant roll-off measurement

Roll off Amount (RoA) profile pattern

Profile on the edge of a Si wafer

Optical metrology at variable sample temperature

Warpage of a chip relative to PCB at 30°C

Warpage of a chip relative to PCB at 120°C