Halbleiter / Mikroelektronik

Semiconductors

The key words are 3D IC, TSV or FOWLP. In the semi-conductor industry innovations come thick and fast, however, new solutions have as yet not been established. This is partly true for applications driven by either IoT or automotive electronics. Using FRT multi-sensor metrology tools you can keep up with the high rate of innovations and yet remain flexible for the necessary change in trend. 

Semiconductor Industry Wafer Thickness Semiconductor Industry Global/Local Wafer Parameters Semiconductor Industry Film Thickness/Layer Stack Semiconductor Industry Bumps Semiconductor Industry Roughness Semiconductor Industry Bond Layer/Thickness Semiconductor Industry VIAS/TSV Semiconductor Industry Trenches Semiconductor Industry Defect Voids Semiconductor Industry Topography (Shape, Structure) Semiconductor Industry Bow/Warp Semiconductor Industry Wafer Thickness (IR) Semiconductor Industry Remaining Silicon Thickness (RST) Semiconductor Industry Stress Semiconductor Industry Nanotopography Semiconductor Industry Saw Marks Semiconductor Industry Roll-Off Amount/Edge Trim Semiconductor Industry Thermal Load