MST / MEMS / Nano

Tiny but intelligent.

At the Personal Devices or also at the car, MEMS set the tone. And they are the drivers of IoT, the Internet of Things. A new industry is emerging that is generating new ideas and applications every day. We help to produce the technologies for it, from development to the finished product.

The right solution for measurement tasks from Micro Electro Mechanical Systems

This is our domain - FRT measuring instruments are at home here. We offer optical surface metrology for various applications from Micro Electro Mechanical Systems.

TOPOGRAPHY (SHAPE, STRUCTURE)

Standard topography measurement

Danfoss SiliconPower GmbH, Area measurement of a leadframe module

Topography measurement of conductor tracks

GLOBAL / LOCAL WAFER PARAMETERS

Measurement of global and local wafer parameters

Full wafer thickness map in 3D view

Wafer map with local parameters (LTIR, LTV, LT, LFPD, etc.)

STEP HEIGHT / WIDTH

Step height and width measurement

Step height and width of a quartz coil

Profile measurement along the red line, step height and width analysis

VIAS / TSV

High aspect ratio vias (TSV)

Area measurement of Through-Silicon-Vias (TSV)

Profile measurement of a single TSV (Depth, Top & Bottom CD)

HYBRID METROLOGY

Combination of different sensors, automated calculation of the desired sample parameters

Example of hybrid metrology

TRENCHES

High aspect ratio trenches

Area measurement of a wafer with trenches

Profile measurement of a single trench

MEMBRANE BOW

Automated deflection measurement on MEMS membranes

Area measurement of a SiO2 membrane

Profile measurement of a SiO2 membrane

THERMAL LOAD

Optical metrology at variable sample temperature

Warpage of a chip relative to PCB at 30°C

Warpage of a chip relative to PCB at 120°C

BGA / BUMPS

Bump dimensions and coplanarity

Topography measurement of a bump array

Profile measurement along the red line, bump height and width analysis

ROUGHNESS

DIN/ISO-compliant roughness and waviness measurement

Area measurement of a bond pad on a PCB, Sa=0.367 μm

Profile measurement of a bond pad on a PCB, Ra=0.096 μm

FILM THICKNESS / LAYER STACK

Thin film and layer stack measurement

Photoresist on a Si wafer

Film thickness of a stack: SiO2 film on a polycarbonate substrate

SAMPLE THICKNESS (IR)

SEMI-compliant thickness and TTV measurement

Thickness of a Si wafer, post grinding

Thickness of a silicon membrane

BOW / WARP

SEMI-compliant bow and warp measurement

Full wafer map of a Si wafer in 3D view showing bow

Profile of the top topography of a Si wafer

STRESS

Wafer stress measurement

Wafer bow before thin film deposition

Wafer bow after thin film deposition

ROLL-OFF AMOUNT / EDGE TRIM

SEMI-compliant roll-off measurement

Roll off Amount (RoA) profile pattern

Profile on the edge of a Si wafer

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