MST / MEMS / Nano

Music everywhere: in personal devices or in your car - MEMS set the tone. And they drive the IoT, the Internet of Things. A new industry is on its way daily creating new ideas and applications. We help to produce the required technologies - from their development to the final product.

WAFER THICKNESS / TTV

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SEMI-compliant thickness and TTV measurement

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Full wafer thickness map in 3D view, polished Si wafer

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4 profiles of a polished Si wafer showing thickness variation

TOPOGRAPHY (SHAPE, STRUCTURE)

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Standard topography measurement

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Danfoss SiliconPower GmbH, Area measurement of a leadframe module

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Topography measurement of conductot tracks

GLOBAL / LOCAL WAFER PARAMETERS

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Measurement of global and local wafer parameters

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Full wafer thickness map in 3D view

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Wafer map with local parameters (LTIR, LTV, LT, LFPD, etc.)

STEP HEIGHT / WIDTH

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Step height and width measurement

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Step height and width of a quartz coil

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Profile measurement along the red line, step height and width analysis

VIAS / TSV

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High aspect ratio vias (TSV)

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Area measurement of Through-Silicon-Vias (TSV)

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Profile measurement of a single TSV (Depth, Top & Bottom CD)

HYBRID METROLOGY

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Combination of different sensors, automated calculation of the desired sample parameters

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Example of hybrid metrology

TRENCHES

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High aspect ratio trenches

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Area measurement of a wafer with trenches

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Profile measurement of a single trench

MEMBRANE BOW

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Automated deflection measurement on MEMS membranes

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Area measurement of a SiO2 membrane

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Profile measurement of a SiO2 membrane

THERMAL LOAD

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Optical metrology at variable sample temperature

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Warpage of a chip relative to PCB at 30°C

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Warpage of a chip relative to PCB at 120°C

BGA / BUMPS

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Bump dimensions and coplanarity

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Topography measurement of a bump array

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Profile measurement along the red line, bump height and width analysis

ROUGHNESS

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DIN/ISO-compliant roughness and waviness measurement

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Area measurement of a bond pad on a PCB, Sa=0.367 μm

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Profile measurement of a bond pad on a PCB, Ra=0.096 μm

FILM THICKNESS / LAYER STACK

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Thin film and layer stack measurement

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Photoresist on a Si wafer

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Film thickness of a stack: SiO2 film on a polycarbonate substrate

SAMPLE THICKNESS (IR)

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SEMI-compliant thickness and TTV measurement

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Thickness of a Si wafer, post grinding

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Thickness of a silicon membrane

BOW / WARP

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SEMI-compliant bow and warp measurement

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Full wafer map of a Si wafer in 3D view showing bow

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Profile of the top topography of a Si wafer

STRESS

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Wafer stress measurement

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Wafer bow before thin film deposition

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Wafer bow after thin film deposition

ROLL-OFF AMOUNT / EDGE TRIM

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SEMI-compliant roll-off measurement

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Roll off Amount (RoA) profile pattern

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Profile on the edge of a Si wafer